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6 CRR-NY 226-1.4NY-CRR

STATE COMPILATION OF CODES, RULES AND REGULATIONS OF THE STATE OF NEW YORK

TITLE 6. DEPARTMENT OF ENVIRONMENTAL CONSERVATION

CHAPTER III. AIR RESOURCES

SUBCHAPTER A. PREVENTION AND CONTROL OF AIR CONTAMINATION AND AIR POLLUTION

PART 226. SOLVENT CLEANING PROCESSES AND INDUSTRIAL CLEANING SOLVENTS

SUBPART 226-1. SOLVENT CLEANING PROCESSES

6 CRR-NY 226-1.4

226-1.4 Equipment specifications and control requirements.

Except as otherwise permitted by the department pursuant to section 226-1.6 of this Subpart, the following types of control requirements must be used by an owner or operator conducting solvent cleaning:

(a) Cold cleaning degreasing when the internal volume of the machine is greater than two gallons.

(1) A cover which can be operated easily.

(2) An internal drainage facility (under cover), if practical.

(3) A control system that limits VOC emissions to those achievable with equipment having a freeboard ratio greater than or equal to 0.5, or a water cover when the solvent is insoluble in and heavier than water. Remote reservoir degreasers are exempt from this requirement.

(4) Cleaning solution with a maximum VOC content of 25 grams per liter at 20°C; prior to December 1, 2020, a cleaning solution with a vapor pressure of 1.0 mm Hg, or less, at 20°C may be used to demonstrate compliance with this subdivision. This paragraph does not apply to degreasers:

(i) used in special and extreme solvent cleaning;

(ii) for which the owner or operator has received department approval of a demonstration that compliance with the requirement of a cleaning solution with a maximum VOC content of 25 grams per liter at 20°C, or with a vapor pressure of 1.0 mm Hg, or less, at 20°C will result in unsafe operating conditions; or

(iii) that are located in a permanent total enclosure having control equipment that is designed and operated with an overall VOC removal efficiency of 90 percent or greater.

(5) Cleaning solution used to clean post-solder printed circuit boards (PCB’s) as well as critical adjunct processes, including the cleaning of raw solder paste and adhesives from hard surfaces, such as stencils and misprinted boards during the printing process, and baked on fluxes (polymerized fluxes) from reflow and wave solder oven components, such as conveyor fingers and condensation traps, may contain no more than 150 grams VOC per liter of solution and must follow all other provisions of this Subpart.

(b) Open-top vapor degreasing.

(1) A cover which can be operated easily without disturbing the vapor zone.

(2) Safety switches which shut off the sump heat if the condenser malfunctions and shall shut off the pump if the vapor level drops excessively.

(3) One of the following:

(i) a freeboard ratio that is greater than or equal to 0.75, and a powered or mechanically assisted cover if the top opening is greater than 10 square feet;

(ii) a refrigerated chiller; or

(iii) local exhaust ventilation and a carbon adsorption unit, or an equivalent system, for collection of VOCs.

(1) One of the following:

(i) a refrigerated chiller; or

(ii) local exhaust ventilation and a carbon adsorption unit, or an equivalent system, for collection of VOCs.

(2) A drying tunnel, rotating basket or other device acceptable to the department which prevents carry-out of VOCs.

(3) Safety switches which shut off the system when the degreaser malfunctions.

(4) Minimize openings at the entrance and exit of the degreaser.

6 CRR-NY 226-1.4

Current through December 31, 2021

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